? dual lga2011 socket supports intel? xeon? processor e5-2600/e5-2600 v2 series cpu ? intel? c602 pch and intel sas rom key design ? (8+8) 240-pin udimm/rdimm/lrdimm ecc 1066/1333/1600/1866 *speed 1866 only for 1 slot per channel 1.5v(blue color dimm slot ) ? up to (6) pci-e gen3 slots by riser ? (4) sata-ii connectors w/ raid 0, 1, 10, 5 support ? (2) sata-iii connectors ? (8) sas/sata 3g ports(scu)enabled by option rom kit ? (3) gbe (via intel? i350-bt2 + intel? 82574l), or (2) 10gbe (via intel? x540-at2) + (1) gbe (intel? 82574l) (-2t sku) ? (7) usb2.0 ports (2 at rear, 4 via cable, 1 type a onboard) ? eatx (12" x 13", 305mm x 330mm) high-end dual-socket server platform for hpc and enterprice virtualization applications gn70-b7056 specifications are subject to change without notice. items pictured may only be representative. front view front view back view back view dual-socket hpc platform B7056G70V8HR / b7056g70w8hr / b7056g70w8hr-2t (8) hot-swap 3.5? sata-ii/ sas hdds (4) fh/fl pci-e (g3) x8 slots + (2) fh/hl pci-e (g3) x8 slots
specifications tyan business unit mitac international corp. gn70-b7056 B7056G70V8HR / b7056g70w8hr / b7056g70w8hr-2t (2) erp1u 770w/ 700w psus 80-plus gold (different skus) hot-swap system fans (4) 6038 (8) 6038 are required for gpu deployment m7056-l24-3f (1) fh/fl pci-e g3 x16 slot (x16/x8) + (1) fh/fl pci-e g3 x8 slot (x0/x8) + (1) fh/hl pci-e g3 x8 slot s7056gm3nr (2) lga2011 sockets (16) r-ddr3 1600/1333/1066mhz (3) gbe ports m1245g70-bp6-8 8-port sas 6g/sata-ii hdd backplane board m1709g70-fpb front panel board m7056-r24-3f (1) fh/fl pci-e g3 x8 slot (x0/x8) + (1) fh/fl pci-e g3 x16 slot (x16/x8) + (1) fh/hl pci-e g3 x8 slot (specifications are subject to change without notice. items pictured may only be representative.) storage gol d 2u rackmou n t gn70 3.43" x 16.93" x 27.56" (87 x 430 x 700mm) s7056gm3nr / s7056w gm3nr / s7056w gm3nr-2t 26kg (1) pw r (w/ led) / (1) rst / (1) nmi / (1) id (1) id / (1) w arn i n g / (1) reserved (3) lan (2) usb ports 3.5" hot-swap / (8) 8-bay for 3.5" hdd ,6gb/s mi n i -sas backpl an e sy stem cooling configuration u p to (8) 6cm h ot-swap fan s (defau l t 4 h ot- sawp fans) erp1u fu l l -ran ge ac(100-240v) 47 - 63 hertz 770 w atts pfc / 80-plus gol d in tel ? xeon ? processor e5-2600/e5-2600 v2 socket r (2) up to 130w* qpi l i n k u pto 8gt/s in tel ? c602 - (8+ 8) dimm sl ots udimm/rdimm/lrdimm ecc 1066/1333/ 1600/1866 *speed 1866 only for 1 slot per channel 1.5v (blue color dimm slot ) u p to 128gb udimm / 512gb rdimm / 512gb lrdimm 4 ch an n el s per cpu 1.5v/ 1.35v u p to (6) pci-e x 8 sl ots by ri ser card m7056-l24-3f, pci-e x 16 2u ri ser card (l eft) m7056-r24-3f, pci-e x 16 2u ri ser card (ri gh t) (3) gbe ports in tel ? 82574l + in tel ? i350-bt2 in tel ? 82574l + in tel ? x 540 (-2t sku) recom m ended t y a n ? riser card pci-e a v erage cpu pow er (a cp) w attage sy stem bus capacity mem ory channel la n port q' ty controller mem ory chipset super i/o efficiency mem ory v oltage processor supported cpu series socket t y pe / q' ty chipset supported dimm qty dimm t y pe / speed expansion slots output watts gross weight sy stem (recom m end chassis) buttons fa n pow er supply t y pe input range frequency supported hdd interface t y pe / q' ty motherboard external driv e bay form factor chassis nam e d i m e n s i o n ( h x w x d ) leds i/o ports front panel controller in tel ? in tegrated raid u pgrade rom 5 (-w sku) speed 3.0 gb/s ra id raid 0/1/10 controller in tel ? c602 seri es speed 6.0 gb/s ra id raid 0/1/10/5 (intel raid stack) d-su b 15-pi n u p to 1920 x 1200 aspeed ast2300 (7) usb2.0 ports (2 at rear, 4 vi a cabl e, 1 type a on board) (1) port (rear) (1) d-su b 15-pi n vga port (2) sata ii con n ectors (3) gbe ports nu voton 83773g mon i tors vol tage for cpu, memory, ch i pset & power su ppl y mon i tors temperatu re for cpu & system en vi ron men t fa n fai l led i n di cator over temperatu re warn i n g i n di cator ch assi s i n tru si on detecti on w atch dog ti mer su pport ami / 8mb pl u g an d pl ay (pn p) /pci2.3 /w fm2.0 /smbios2.3 /px e boot / acpi 2.0 power man agemen t /power on mode after power recovery / user-con fi gu rabl e h/w mon i tori n g / au to-con fi gu rabl e of h ard di sk types cl ass a y es 10 c ~ 35 c (50 f~ 95 f) - 40 c ~ 70 c (-40 f ~ 158 f) 90%, n on -con den si n g at 35 c rohs y es rj-45 vga s y s t e m m o n i t o r i n g t em perature com graphic connector ty pe resolution i n p u t / o u t p u t usb bios regulation fcc (doc) ce (doc) sa t a sa s (opt.) storage chipset operating env ironm ent operating t em p. non-operating t em p. in/non-operating hum idity rohs 6/6 com plaint chipset voltage t em perature brand / rom size feature led (on sy stem fro nt panel) usa tel: +1-510-651-8868 fax: +1-510-651-7688 taiwan tel: +886-2-2652-5888 fax: +886-2-2652-5805 china shanghai tel: +86-21-61431188 ext 1366 china tel:-86-010-62555015 ext 8302 japan tel: +81-3-3769-8311 fax: +81-3-3769-8328 europe sales: +32 2456 1721 technical support: +32 2456 1722 m1601t70-d-pdb power distribution board
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